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Thread: IC Diamond 24 Giveaway

  1. #17
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    Quote Originally Posted by grumpydaddy View Post
    You will likely know the typical characteristics of i7 920, 950 and 2600k I have all copper EK HF's fitted (the SB has the easymount) and would be happy to do any extended testing that you need with this gear. This would maybe allow some of the others here to run simpler testing with their samples.

    PM me with your needs and we can take it from there.
    EK blocks would be great as data I have on those is "middling" between the Corsair and the lessor data results.

    I would like to more of a cross section of samples of both Convex blocks and flat ones to flesh out my understanding

    Have plenty of samples available - good for 10 -12 applications

  2. #18
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    I have an EK block what do you want to be done exactly?

    Feel frre to PM me or send me an email @ my pureoc address.

  3. #19
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    Quote Originally Posted by smduff View Post
    I have an EK block what do you want to be done exactly?

    Feel frre to PM me or send me an email @ my pureoc address.
    EK or any WB

    send me your address to support@innovationcooling.com title C/P

    Test is simple, you place two different pieces of plastic contact paper (labeled A& between sink and IHS without compound - shiny sides to the metal - frosted sides facing each other - mount sink as you normally would then dismount and you have a snapshot of your contact and pressure.

    One paper is the donor and the other is "print" as you have seen in the posted examples as the raw image before digital processing - throw the donor out.

  4. #20
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    I sent it the other day

  5. #21
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    Quote Originally Posted by smduff View Post
    I sent it the other day
    I have five of these going on right now - so hard to track the only thing we save after shipping is the mailing address without aliases so we can check on any not received and after giveaway is complete we delete them, too much clutter in the mail box

  6. #22
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    Sent you a PM

  7. #23
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    @ grumppy & smduff; I believe your EK block is not bowed, if you want it to bow then you need to do a little mod. Change the O-ring or the jet plate to thicker one.

    If you have bowed block, there's a particular mount orientation for it to yield maximum thermal performance. The bowed center line must be perpendicular to the processor's cores. The above illustrated image is incorrect. If you have incorrect mount the block will perform worst than the flat base block. This is the reason people lapping their cooler and ISH to give better contact surface.

    Because bowed base is harder to mount due to the rocking movement when you apply unevent pressure on each corner mounting screw.

    @ andrew; you will have varies results all over the map due to too many testers with different testing enverioment, equipment and human error.

    For instance the resutls from OCUK forum, it's showing the Corsair block perform better than the stand alone blocks. I have to disagree on this.

  8. #24
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    No my block is flat not bowed.

  9. #25
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    Quote Originally Posted by smduff View Post
    No my block is flat not bowed.
    I knew that but I think Andrew looking for more clear result on bowed block.

    you can mount any other orientations (vertical or horizontal) and still yield similar result.

  10. #26
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    Am I eligible to participate in this? As I reside in Asia Shipping to me an issue?
    I'm really keen to test the IC Diamond products. I wouldnt mind testing out on the EK Blocks Waterblock I'm using for my GTX580

  11. #27
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    I don't think it's a problem for IC to mail you couple tubes to Singapore so you can test it on the GTX580.

  12. #28
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    Sure, i would like to participate & thanks for the opportunity have not yet tried IC Diamond 24 and will post as necessary
    email sent.
    "You're never to old to learn something stupid."

  13. #29
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    Quote Originally Posted by Deton View Post
    @ grumppy & smduff; I believe your EK block is not bowed, if you want it to bow then you need to do a little mod. Change the O-ring or the jet plate to thicker one.

    If you have bowed block, there's a particular mount orientation for it to yield maximum thermal performance. The bowed center line must be perpendicular to the processor's cores. The above illustrated image is incorrect. If you have incorrect mount the block will perform worst than the flat base block. This is the reason people lapping their cooler and ISH to give better contact surface.

    Because bowed base is harder to mount due to the rocking movement when you apply unevent pressure on each corner mounting screw.

    @ andrew; you will have varies results all over the map due to too many testers with different testing enverioment, equipment and human error.

    For instance the resutls from OCUK forum, it's showing the Corsair block perform better than the stand alone blocks. I have to disagree on this.

    bowed or flat I would like samples of both - The question is not whether the WB is better in terms of overall performance and I am sure the stand alone blocks perform better than the corsair.

    Heat flows hot to cold so a better block will provide better overall temps. What I am looking at is thermal compound performance, the corsair had better thermal compound deltas and the stand alone results were "homogenized" with only a degree or two in the deltas indicating a thermally choked condition.

    This is an effort to quantify the "all over the map" results, thermal compound is a mechanical function - Contact & Pressure.

    If you quantify the result you can qualify it and can explain the differences in performance.

    Poor contact and/or pressure usually ends up showing a group compounds all testing a degree or two within each other (Thermally Choked) hence people will draw the conclusion there is no real difference erroneously without qualifying the comparison

    Our Trouble shooting Guide was developed and acquired through a beta testing program with actual independent users and extensively documented. Data from the testing can be found on the pages Pressure Results and Thermal Results.

    Technical/Troubleshooting Note:

    As most experienced users understand that when troubleshooting thermal problems there are usually 3 areas of concern.

    1.) Pressure
    2.) Contact
    3.) Application

    Taking a thermal measurement on it's own is not enough without a relative basis of comparison. Application and use of thermal compound is a mechanical function though many electronically oriented people tend to attach little importance to mechanical measurements.

    Every thermal compound has it's own unique ideal pressure/thermal performance curve. A highly liquid retail compound with great contact resistance will test well at low or moderate pressures as they hit their Bond line thickness (BLT) or average thickness relatively easily but since they are at optimum at these lower pressures adding more pressure fails to yield much of an improvement.

    IC Diamond is of a much higher viscosity and has a very different pressure/ performance curve than a more liquid retail compound so at lower pressures and/or contact thermal results maybe equal or less. In paste reviews the major failure is in quantifying the mechanical aspects of what is being tested, are they @ 35lbs and 50% contact area? or 60lbs 60% contact? And how does that relate to multiple thermal/performance pressure curves of different compounds?

    Note: 80% of sampled retail sinks were over 50lbs psi

    Quantifying mechanical's is not realistic for the individual user but they get around that by observing multiple user results to mentally average a comparison unlike the individual anecdotal test they have a reference point(s) more or less like we are doing here providing samples for comparison.

    We generated the attached charts Below from some forum user tests .

    What they show is what most know already - that good C/P provides a good thermal result. What it also shows is that IC Diamond performance margins increase with over 50 psi force and with good contact margins are higher. Pressure is dominant and contact will increase with pressure.



    Data point # 2 has weak pressure and poor contact resulting in a + 3.7C increase in temps over the liquid paste. Data point # 10 with great contact and pressure shows a -5C improvement over the more liquid compound. This is a nontrivial approx 9C spread and pretty well explains why people get different results.

    Also observe Point # 6 it has a somewhat lower pressure but a higher contact hence the improved thermal

    So to optimize your thermal result, apply enough compound, tighten your sink and do some lapping

  14. #30
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    Hello Andrew/IC,

    I have an i7 920 D0 overclocked to 4.2 GHz on Air for testing purposes; my most recent test is here. Testing is performed within a closed Cooler Master HAF 922. Will happily supply results if included.

  15. #31
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    Andrew, 2nd email sent (as requested)
    Rig2: 2*e5-26xx (16c/32t @2.4), Asus z9 pe-d8 ws, 32gb ripjawsz under water, rig3 2*e5-26xx (16c/32t @2.4), Supermicro 7047A-T 16GB 1600 ecc reg, on air, Rig4: 2*e5-26xx (16c/32t @3.1), Supermicro x9 DAi 16GB 1600 ecc reg, on air, Rig5: 2*e5-2660 (16c/32t @2.7), Supermicro x9 DRW iF 32GB 1600 ecc reg, on air

  16. #32
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    Quote Originally Posted by IC Diamond View Post
    Heat flows hot to cold so a better block will provide better overall temps. What I am looking at is thermal compound performance, the corsair had better thermal compound deltas and the stand alone results were "homogenized" with only a degree or two in the deltas indicating a thermally choked condition.

    This is an effort to quantify the "all over the map" results, thermal compound is a mechanical function - Contact & Pressure.

    If you quantify the result you can qualify it and can explain the differences in performance.

    Poor contact and/or pressure usually ends up showing a group compounds all testing a degree or two within each other (Thermally Choked) hence people will draw the conclusion there is no real difference erroneously without qualifying the comparison
    there you have it guys, it's all up to you how good you can apply the pressure and contact to your block or cooler to yield maximum performance.

    High pressure = better Sq" contacting surface = better performance

    the issue here is how the user knows how much pressure applied to the cooler or block? Unless you have a special torque wrench.

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