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Thread: Pure Overclock Official IC Diamond Test Results

  1. #49
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    Default Re: Pure Overclock Official IC Diamond Test Results

    I'm on the brink of lapping this cpu, Would you prefer that I repeat the tests first? I feel that using the maximums has not really been of great value and that there may be more benefit in recording the average temps for the duration of the test.

    The springs are not as easy to get for me as I first thought. still doable but I'm trying to buy in small quantity.
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  2. #50
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    Default Re: Pure Overclock Official IC Diamond Test Results

    Result is what I would expect with the contact profile, so no need to retest. I am putting together a little analysis from other user tests that may provide some guidance.

    Next to the Corsair the EK blocks are better than most but still a mixed bag, some pretty good and some not so good. Blocks hanging on the edges as noted the differences between test results may be the variability of the IHS contours if the blocks themselves are uniform. although other factors may be involved.

    Hard to overcome the IHS "cupping" with pressure alone - I have seen 100+ PSI on the edges with little improvement performance

  3. #51
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    Default Re: Pure Overclock Official IC Diamond Test Results

    Quote Originally Posted by grumpydaddy View Post
    IC Diamond testing part 1

    My EK Extreme High Flow block has the Easy mount kit fitted. The kit contains springs designed to ensure that the user experience is consistent. In one place I found the following info: “Each of the springs offer 7,8 kg of pressure, and therefore optimal pressure of 30 kg (66lbs) on CPU can be achieved”. Those of you that know the size of the CPU is 37.5mm x 37.5mm will realise that the area here is 1406mm2 or 2.17 sq. in. This results in a pressure applied of 30.36lbs/psi. Now I don’t know much about engineering but I thought that compression springs are sold in given dimensions and with a given spring resistance rate which here in Europe would be in N/mm and that this would in effect mean that a force of “x” Newtons would be applied for every mm that the spring was compressed. This leads me to ask if the 7.8KG of pressure mentioned above would be when the spring is fully compressed.

    The first series of tests will be completed using this “stock” configuration. The thumbnuts are tightened until the springs begin to bind. This can be both felt and heard.
    In the later part of the week I hope to experiment to find the torque settings that will cause thread failure in brass 4mm nuts and screws. When this is completed I hope to source some springs that are “uprated” and use the pressure film provided to show the expected advantage gained.

    The current Installation used is MX2 and is around 3 months old. Application was using the“pea” in the centre method
    The rig is connected to the MOAF cooled System. There are 2 other rigs running on the system but the test rig is located in a position on the loop where there is no further influence on the result than that of the base temp of the water.
    Ambient temperature today at start of test is: …….21.9Deg C. as measured at the fan intake.
    After 15 minutes of steady state the idle temps in Deg C are
    CPU: ……….15
    Core1: ……….24
    Core2: ……….24
    Core3: ……….24
    Core4: ……….24
    Water in temp: ……….22.8
    Water out temp: ……….22.8
    Testing is with my i7 2600k that in this instance is set to run at 4.7Gig and 1.476v load volts (yes, I know! L)
    Latest version LinX (0.4.6) set to Max mem, with largest problem size. The following are Maximums seen during the test, these measurements taken after 30+ minutes although to be honest a ten minute test would suffice.
    CPU: ……….55
    Core1: ……….55
    Core2: ……….65
    Core3: ……….60
    Core4: ……….60
    Water in temp: ……….22.8
    Water outtemp: ……….23.1



    First pressure film was used tightening the thumbnuts as described above
    Second pressure film was used as above then tightened a further 1/2 turn


    __________________________________________________ ___________________________________

    Application,as per the instructions at Innovation Cooling, of the Diamond Tim I chose to be more at the 5.5mm end of things having seen the pressure images
    I ran LinX for around half an hour then restricted the water flow to take the temp up to 80 degrees where I held for 5 mins. An extra half turn was applied to the thumbnuts then the rig was left to run WCG overnight.There are two reasons for this, first is that ambient had dropped by 5 degrees by this time, and second was to give the ICD time to “cure”



    Testing continued on day two

    Ambient temperature today at start of test is: …….22.9 Deg C.
    After 15 minutes of steady state the idle temps in Deg C are
    CPU: ……….15
    Core1: ……….24
    Core2: ……….24
    Core3: ……….24
    Core4: ……….24

    Water in temp: ……….23.8
    Water out temp: ……….23.8

    Bear in mind the ambient differential of 1 Deg C

    The following are Maximums seen during thetest, these measurements taken after 30+ minutes
    CPU: ……….54
    Core1: ……….55
    Core2: ……….65
    Core3: ……….61
    Core4: ……….61
    Water in temp: ……….23.8
    Water out temp: ……….24.0


    First test results
    CPU: ……….1Deg improvement
    Core1: ……….0deg difference
    Core2: ……….0deg difference
    Core3: ……….1deg worse
    Core4: ……….1deg worse

    Taking into consideration the Ambient temps this is then seen as

    CPU: ……….2deg improvement
    Core1: ……….1deg improvement
    Core2: ……….1deg improvement
    Core3: ……….0deg difference
    Core4: ……….0deg difference

    Conclusion:

    My set-up is not exactly testing friendly in the summer …. There is too much fluctuation in ambient temperatures, however in terms of absolute maximums there is still some improvement to be seen when this is taken into consideration.
    Perhaps less scientific, but as an observer during the testing I would say that, in the round, I was seeing one maybe two degrees improvement across the board throughout the test even though the maximums appear to show otherwise. I will attempt to graph the next mount
    I need to repeat this testing during more consistent weather or at night. Further mounts may also be useful for identifying the optimum amount of applied TIM

    Finally ….Boy oh boy do I need to lap this sucka. In fact I may do that and repeat the above sequence ... Thoughts anyone?
    This is what I was referring to in post # 15 As in figure 2 the thermal paste advantage can not be measured accurately as the IHS resistance dominates the result and exactly the type of info I was looking for.

    The bowed bases whatever their advantages start with about 30% of the contact area by design and so more susceptible to secondary effects that influence in contact and pressure, unstable might be a better word so needs more detail to get just right at least as far as thermal compounds are concerned.





  4. #52
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    Default Re: Pure Overclock Official IC Diamond Test Results

    I just did some double checking on the results above and as a result I want to point out that the orientation of the images is wrong. From the pressure films it seems that my setup is similar to this:




    The reality of the situation is that the image needs to be rotated so that the pressure line across the cpu, however feint, is in line with the cores. To further prove a point I installed the cpu block at 90 degrees to normal and the pressure image remains the same.

    EDIT: now changed in imageshack to better show the correct orientation
    Last edited by grumpydaddy; 29-08-2011 at 19:56.
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  5. #53
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    Default Re: Pure Overclock Official IC Diamond Test Results

    Quote Originally Posted by grumpydaddy View Post
    I just did some double checking on the results above and as a result I want to point out that the orientation of the images is wrong. From the pressure films it seems that my setup is similar to this:




    The reality of the situation is that the image needs to be rotated so that the pressure line across the cpu, however feint, is in line with the cores. To further prove a point I installed the cpu block at 90 degrees to normal and the pressure image remains the same.


    Thanks for the detail, much appreciated and is important.

    I think you still run into a resistance problem as the heat will still tend to flow to the higher contact/pressure areas.


    Sensor products changed their paper this year and I am not real good interpreting the new raw images yet so I am relying more on the lab analysis results.

    So I Think this is what's happening but I will not know till I get the report where data is split into a grid ( 200 data points) and you can analyze indidual areas of interest which you will see when you send back the paper and I email you the report.

    Note that the raw image below shows some contact on center but if you observe the line scan below pressure drops to/below the threshold of the papers lower limit of 28 lbs

    Now this does no mean that the heat does not flow at all to the sink on center it just does so inefficiently due to a thicker paste and low pressure.

    As in figure two "Reduced Contact" Rather than model it with contact on center split it in two with high contact/pressure at either end and reduced contact on center.








  6. #54
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    Default Re: Pure Overclock Official IC Diamond Test Results

    Thank you for your input Andrew.

    The pressure films that you sent will be on their way to you tomorrow.

    I used one to confirm the pressure pattern did not change when the cpu block was rotated through 90 deg (it didn't)

    The other two are showing degrees of lapping and the impact on this block/mounting kit when used as per EK's instructions.

    A more full description of each test is included in the letter.
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    Default Re: Pure Overclock Official IC Diamond Test Results

    I must be a real dunce I tried the pressure paper today and didn't get an impression at all, or is my paper broken

  8. #56
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    Default Re: Pure Overclock Official IC Diamond Test Results

    If you got the films as planned in one envelope should be a somewhat clear film and in the other a more white film ...yes?

    place white film shiny side down on cpu, place clear film shiny side up on top of the white film.

    carefully assemble cooling on top of cpu WITHOUT TIM (try not to move once contact is made) and tighten.

    on completion remove cooling and discard the clear film. The image should be on the white film.
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  10. #57
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    Default Re: Pure Overclock Official IC Diamond Test Results

    I moved on for now just applied the TIM a few hours ago and am currently watching temps, once I'm done recording them I will redo the pressure test.

  11. #58
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    Default Re: Pure Overclock Official IC Diamond Test Results

    When a block is bowed then no matter which orientation it has the contact pressure is still the same. However, you might receive better thermal transferring if all cores are covered.

    If you have a block with extremely bowed like the above sample image and have it crossed the cores like that. The obvious two outsider cores won't get better cooling, in the end the over all temperature will be worse.

    Look at Grumpy's results, he has one core is over 10°C different. From my experience of water cooling testing you should have more the 5°C between cores.
    The high differential in temp like that could be uneven pressure apply to the bolts or the block is to extreme bowed.

    I don't know how old is the Supreme HF block but the extreme bowed blocks are use to be good with single core processor. Today, CPU water blocks are hardly bowed because the design for today's multi-core processor. Even, if the block is bowed, the convex line is very small you barely notice with the naked eyes unless you do the straight line test. So when a block has low bow point, it will flatten out when you apply enough pressure on four corner screws.

    See my review images here http://pureoverclock.com/review.php?id=1296&page=4

    K
    oolance CPU370 block is the one I will be using for the test, this will provide you enough information how bowed block performs. The bowed line will be mounted parallel to the core direction.

    FYI, the core area is pretty small, it has only few mm wide/long. IMO, therefore it is not necessary to lap the heck out of IHS so you can get better contact at the perimeter of the CPU. If you want to see the size of the core, just remove the CPU at look at the socket for the rectangular open at the center of the socket.

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    Default Re: Pure Overclock Official IC Diamond Test Results

    Here are my results.

    IC24 vs MX-4

    Testing Method:
    BB-size were use for both pastes, let it idles for 1 hour, 30 minutes burn-in and 30 minutes to neutralize the temperature.
    BurnIn Test Pro was use to do the load test, ADIA64 was use to monitoring.

    Test setup:
    2600k - 5GHz, 1.5v (according to CPU-Z), 1.47v is actual in the bios.
    RX360 rad with Koolance CPU-370 block (micro-bowed base).

    I didn't receive the pressure paper so you guys have to look at my pretty TIM imprinting instead.
    I contacted Koolance asking for the spring specification but they can't help me because they have no idea what its PSI rate.
    So I did some bulkpark calculation, each spring shouldn't have more than 8lb/psi (more like around 6lb/psi). I think the estimate torque for the CPU-370 block is around or no more than 30lb/psi.

    The springs were totally compressed, max out!

    As you can see the below image, the paste was a little tad short to give a perfect square imprinting of the IHS.



    Results
    MX-4IDLELOADIC24IDLELOADIC24 3days curingIDLELOAD
    Ambient2324 2324 2324
    H202328.9 2328.7 2327.2
    CPU6026 6125 5925
    Core 02653 2561 2559
    Core 12559 2555 2553
    Core 22658 2561 2558
    Core 32658 2661 2657

    Thoughts:
    IC24 is a high density paste, it's harder to spread than other TIMs and if you use it too much then it becomes to thick to cure under low pressure mount. It needs more than 2 hours of the recommended time to cure, especially for the low pressure coolers/blocks. I tested it after 1.5 days, the temp dropped by 0.5°C and another 0.5°C after 3 days.

    Even after 3 days the paste still haven't completely dry, it was still a little bit sticky to touch.

    My in-conclusion is IC24 might performance better if it's totally cure. How long and how much it's regain? that is need to do some more test on it but in the mean time I'm running out of time.

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    Default Re: Pure Overclock Official IC Diamond Test Results

    I now have pressure paper, if anyone did not receive theirs, please send me a PM with your shipping information and I'll send it to you with a tube of 24K

    Thanks

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    Default Re: Pure Overclock Official IC Diamond Test Results

    Test results on a Asus P8Z68 Deluxe set to burn in on the bench. Set to default, no OC.
    2600K, H100.

    Idle = 15 minutes after power on.
    Load = Prime95 for 1 hour.

    Artic Alumina
    Ambient = 22
    Idle - 28,27,28,27
    Load - 51,51,52,51

    Artic Silver 5
    Ambient =22
    Idle - 28,27,27,27
    Load - 52,53,54,53

    IC Diamond
    Ambient = 22
    Idle - 27,25,27,27
    Load - 50,51,51,51

    All done in the same day with 1 hour curing between tests.

  17. #62
    OC Jedi Master

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    Default Re: Pure Overclock Official IC Diamond Test Results

    Bob, the IC24 will drop by 1°C after 24hrs. I don't think you will getting any better than that with Coolit Vantage.

  18. #63
    Regular Member

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    Default Re: Pure Overclock Official IC Diamond Test Results

    Thanks, this is set up on my bench with a Corsair H100. I will test again in a couple of days, but only the IC Diamond.

  19. #64
    OC Jedi Master

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    Default Re: Pure Overclock Official IC Diamond Test Results

    Yeah, you don't have to retest it all. I'm just telling you just in case you wonder why your IC24 didn't get any better than Artic Silver.
    It needs to be cured, IC says it needs at least min of 2hrs but with low pressure mount coolers take a lot longer.

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