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Thread: Pure Overclock Official IC Diamond Test Results

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    Default Pure Overclock Official IC Diamond Test Results

    PLEASE READ THOROUGHLY BEFORE TESTING/POSTING YOUR IC DIAMOND TEST RESULTS!!!



    PLEASE ONLY POST WITH RESULTS WHEN YOU HAVE FULL RESULTS, OTHERWISE YOUR POST MAY NOT BE SEEN BY ALL IF YOU RESERVE THE POST FOR LATER RESULTS WITH IC7. PEOPLE TEND TO GO TO THE NEWEST POST, SO IF YOU WANT IT TO BE SEEN BY ALL, POST YOUR RESULTS ONCE YOU HAVE THEM ALL. ALL OTHER DISCUSSION/SUPPORT POSTS, GO RIGHT AHEAD!!

    PLEASE BE SURE TO BENCHMARK YOUR CPU TEMPS WITH YOUR CURRENT TIM AND RECORD YOUR RESULTS BEFORE USING IC7 FOR TESTING. WE NEED BEFORE AND AFTER PLEASE!

    ALSO, PLEASE MAKE SURE YOU DON'T CHANGE ANY VARIABLE OTHER THAN THE THERMAL COMPOUND USED FOR BEFORE/AFTER (I.E. SAME VOLTS/CLOCKS, COOLER, AND OTHER HARDWARE)


    APPLICATION METHOD


    For all those participating in the ICD giveaway, please follow this link to the Innovation Cooling website for more information on the products:

    Innovation Cooling

    Proper application is the key to this product. The nature and consistency of this product is likely quite different from what most of you are used to in a Thermal Compound. We don't recommend use of traditional methods of applying the TIM like razor blades, lines, Rice size, etc. ARE ALL Big BIG NO NO's. Through extensive end user testing, the best overall application method has been determined to be a pea sized amount directly in the center of the CPU. The TIM should be adequately spread via the down force of the CPU cooler (a sufficient amount of down force will provide best results; minimum 50psi of down force should be the goal for optimum results. please see the Innovation Cooling website for more info). Also, for coolers/surfaces that have many peaks and valleys, it may be beneficial to wet the surface(s) with a small amount of ICD/Perihelion to initially fill the voids in the mounting surfaces...then proceed with recommended application as usual. Please click on the link below for application methodology and shoot me a PM if you have any questions.
    Keep in mind, ICD/Perihelion has been formulated with the specific goals of providing superb thermal conductivity with short set times, but also for long term stability and performance without pump/bake out through extended thermal cycling or usage. This stuff is very stable over long periods of time.



    Please do feel free to navigate through the whole Innovation Cooling website as there is tonnes of information on there that might prove beneficial.


    HOW TO POST RESULTS


    THE FORMAT IS AS FOLLOWS (ALL TEMPS IN C):

    OPTIONAL INFO: PROCESSOR, VOLTS/CLOCKS, HEAT SINK/COOLING USED, ETC.

    Before Compound:
    Ambient Temp:
    Idle Temp:
    Load Temp:

    ICD/Perihelion
    Ambient Temp:
    Idle Temp:
    Load Temp:

    Added 5/22 - Cure Time- Cure Time averages 2 hours in most situations for sinks with adequate pressure loading with maybe .5C more overnight. Lightly pressure loaded sinks may take a day or more depending on the amount of pressure


    If you have any problems or need support, please feel free to post here for now. Remember, proper application and good even heat sink pressure (goal should be minimum of 50psi or more) are crucial for peak performance. Too much or too little compound will impact your results so please do visit the Innovation Cooling website for Application Instructions with images and explanations. For those with direct touch heatpipe coolers, you might want to try wetting the contact surface of the cooler with a tiny amount of ICD to fill any small voids before proceeding with the normal application method.

  2. The following users thank 3 For this above post:

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    Quote Originally Posted by IC Diamond View Post
    minimum 50psi of down force should be the goal for optimum results.
    Is there a special calculation the PSI or tool for this or they just tighten the cooler or block by feel or max out the tension of the springs?

    Edit: if there a installation guide included in the send-out samples then ignore my question.

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    Quote Originally Posted by Deton View Post
    Is there a special calculation the PSI or tool for this or they just tighten the cooler or block by feel or max out the tension of the springs?

    Edit: if there a installation guide included in the send-out samples then ignore my question.

    Most (80%) after market coolers are over 50 psi to begin with - I just emphazie it Ad nauseam because you only have a couple of things that affect getting the most out of your paste and that's application - contact and pressure. Stuff people know already but sometimes forget.

    So thanks for reminding me another troubleshooting note

    http://www.evga.com/forums/tm.aspx?m=681429&mpage=1

    This guy re torqued after a warm up period - the idea is
    like re-torquing the head gasket on the old cars after the first 1,000 miles.

    Compound spreads with heat and pressure so on a screw system if left at the first torque point paste will thin out but distance between sink and IHS remains the same so you would not see the optimal bond line.

    So he had several degrees improvement - If you lack a a torque wrench he indicated he could get a couple more turns on the screw after a 10 min. warm up

    torqued all gpu screws to 180oz wait 5mins then re torqued to 220oz then 5mins then torqued to 415oz done
    i have a lot of tools and rebuild motherboards and graphics cards almost every day i been sick
    do to how thick this stuff is i think anyone that use it might want to let sit 10mins and torque them down a 2nd time
    after 5mins with each step i got almost 2 full turns more on the screws the hold around gpu

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    Indeed, nowaday most coolers has backplate but some of them are no good for 50PSI. It's a lot of pressure, this is also a minimum pressure for TEC cooler when we clamp the sucker down. So people make sure you have strong backplate....BTW, Intel push-pin coolers or any other push-pin systems won't yield you any best results.

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    Thanks you sending the TIM sample here are some of the results I had, with the rig in my sig.Some may find the CPU cooler a bit different with this chassis both fans are intake & with hot air out the sides here is a pic.
    Note tested on an untapped heatsink and no contact paper to verify contact impression.




    CPU:Intel i7 870 @ 3792.0 GHz >>24x158 Turbo Enabled
    Vcore: 1.256
    Vtt: 1.19
    Dram:1.58

    Measured and tested with IntelBurnIn Maximum settings 8 threads 5 passes and CoreTemps.

    >>>Antec 620 Kuhler in Silverstone SG07 Chassis

    Before Compound
    OEM preappplied from original install ShinEtsu X23-7868-2D [ I think that is what the use]

    Ambient Temp:25 C
    Idle Temp:38C
    Load Temp:65C

    Also tested with AC MX-2 prior using the IC Diamond method of TIM application warm etc.
    Ambient Temp:25 C
    Idle Temp:35C
    Load Temp:65C

    ICD/Perihelion
    Ambient Temp:25C
    Idle Temp:37C
    Load Temp:64

    ***What I did notice was that I did check the IC Diamond paste after an ample burn in period and get a few extra turns on the screws ,.Expecting noticeably better results I did check and remount the cooler.and repeat the burn in and test sequence.
    Note the mainboard backplate is plastic not metal on the Antec 620 .Sure I can torque the screws but maybe there a bit of deflection with the plastic backplate ?

    Thanks again for the sample and allowing me to participate.
    Last edited by rrplay; 22-07-2011 at 08:52. Reason: Added not RE: unlapped heatsink and no contact paper used.
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    I haven't received any TIM yet nor do I know if I will but here are my temps @4GHZ using Shin-etsu after 1 hr of prime.



    Well I have to say I'm a believer, room temps remained the same or maybe it was just the way the TIM was applied I'll have to try and reseat it with my shinitsu and see but great results none the less

    Last edited by smduff; 14-09-2011 at 13:09.

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    plastic backplate can't handle over 50lb psi.

    I also think Andrew needs to revise the testing procedure, need to be more specific on which burn-in program should be using. Because IBT, Prime95 or OCCT don't generate the same amount of heat.

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    Quote Originally Posted by Deton View Post
    plastic backplate can't handle over 50lb psi.

    I also think Andrew needs to revise the testing procedure, need to be more specific on which burn-in program should be using. Because IBT, Prime95 or OCCT don't generate the same amount of heat.
    Since I do not have a proper way to measure the torque I did notice a difference in how much I was able to turn the mounting screws after using OCCT and LinPack [LinX0.6.4].If I had received some contact paper would have lapped heatsink and checked and likely would have achieved better results.

    May likely try again to compare AC MX-2 and Diamond after lapping another time.

    Will be most interesting to see what the results will be from you guys working with much better setups and expertise.
    Last edited by rrplay; 22-07-2011 at 09:12.
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    Jim, your post was removed, Andrew started this thread to get results, not clown around. Guys, please stick with results only in this thread.

    Thanks

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    Intel Core i7 920 @ 4.2 GHz (200x21), 1.28v

    Prolima Tech Super Mega with push/pull Noiseblocker M12-P @ 1000-2000 rpm & 43-78 CFM.

    Closed HAF 922 case with 200x230mm front/top/side Cooler Master @ 700 rpm, 120mm rear/bottom Noiseblocker M12-S2 @ 1250 rpm.

    All testing performed using Prime 95 for 2 hours at this setting: In-place large FFTs (maximum heat, power consumption, some RAM tested). Temperature readings taken with Core Temp 0.99.8.

    IC Diamond 24 Carat (before curing)
    Ambient Temp: 23
    Idle Temp: 40
    Core 0: 41
    Core 1: 38
    Core 2: 42
    Core 3: 38
    Load Temp: 73
    Core 0: 75
    Core 1: 73
    Core 2: 73
    Core 3: 72

    IC Diamond 24 Carat (after curing)
    Ambient Temp: 23
    Idle Temp: 39
    Core 0: 39
    Core 1: 37
    Core 2: 41
    Core 3: 37
    Load Temp: 72
    Core 0: 74
    Core 1: 72
    Core 2: 72
    Core 3: 71

    Tuniq TX-4
    Ambient Temp: 24
    Idle Temp: 40
    Core 0: 40
    Core 1: 38
    Core 2: 41
    Core 3: 37
    Load Temp: 71
    Core 0: 73
    Core 1: 71
    Core 2: 71
    Core 3: 70

    OCZ Freeze
    Ambient Temp: 24
    Idle Temp: 40
    Core 0: 41
    Core 1: 39
    Core 2: 42
    Core 3: 38
    Load Temp: 73
    Core 0: 75
    Core 1: 73
    Core 2: 72
    Core 3: 72

    Thermalright "The Chill Factor"
    Ambient Temp: 24
    Idle Temp: 40
    Core 0: 41
    Core 1: 39
    Core 2: 43
    Core 3: 38
    Load Temp: 73
    Core 0: 75
    Core 1: 73
    Core 2: 73
    Core 3: 72

    Prolima Tech Thermal Compound
    Ambient Temp: 24
    Idle Temp: 41
    Core 0: 42
    Core 1: 40
    Core 2: 43
    Core 3: 39
    Load Temp: 75
    Core 0: 76
    Core 1: 75
    Core 2: 73
    Core 3: 74

    Zalman ZM-STG1
    Ambient Temp: 24
    Idle Temp: 41
    Core 0: 42
    Core 1: 40
    Core 2: 43
    Core 3: 40
    Load Temp: 75
    Core 0: 76
    Core 1: 75
    Core 2: 74
    Core 3: 73
    Last edited by ZeroChill; 25-07-2011 at 01:37.

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    @zerochill; according to your results the IC24 fail short after TX-4 by 1C.

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    Yeah, that doesn't sound right, it should be lower than 1c both at idle and under load

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    I ran 4 separate tests with ICD - each time cleaning and reapplying the TIM as well as examining the spread afterwards - basically the same results each test run with very little deviation. Surprised me also. Perhaps this Super Mega does not apply adequate pressure for ICD to show its best.

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    With a 990X at 4.8GHz . and one at 4.6GHz I saw a 4c drop all around. after running for 4 hours I had a 5c drop in temps. With your system at 4.2GHz I'm not sure why your only seeing 1c, even my STG1 and ST2 tests showed better results than what your seeing, which is why I said your results didn't sound right.

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    it got to be mounting pressure then.

    Andrew did say the IC 24K works best beyond 50lb psi. If you want to achieve this kind of pressure then your backplate must be strong. The flimsy plastic one won't do it.

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    Quote Originally Posted by Doctor_Death View Post
    With a 990X at 4.8GHz . and one at 4.6GHz I saw a 4c drop all around. after running for 4 hours I had a 5c drop in temps. With your system at 4.2GHz I'm not sure why your only seeing 1c, even my STG1 and ST2 tests showed better results than what your seeing, which is why I said your results didn't sound right.
    Any suggestions on what to try differently?

    Have tested different amounts of ICD as well: as in a bit too little, a bit too much, etc; no significant difference in temps. The TX-4 was applied via a spreader to achieve full coverage (as specified by the manufacturer) prior to mounting ... I am tempted to try that with ICD also.

    My system is still setup with that last "after curing" test case, and so I will be running a another test "as is" to see if the extra 24+ hours of normal usage has had any affect on temperatures.

    Quote Originally Posted by Deton View Post
    it got to be mounting pressure then.

    Andrew did say the IC 24K works best beyond 50lb psi. If you want to achieve this kind of pressure then your backplate must be strong. The flimsy plastic one won't do it.
    I am leery of using the optional 70 pound pressure screws that came with the Super Mega, for fear of potential damage to the motherboard.

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