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Thread: Delidding/OC Results (Kind of disappointed)

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    Default Delidding/OC Results (Kind of disappointed)

    I completed my first build last week. And I just finished my first delid tonight, and the overall process went smooth.I used the vice/hammer/wood method and used AS5. Took about 3hits and it popped off. Yup- returning the vice to Home Depot tomorrow .... I wasn't really going to delid my cpu, but sadly I bought a below average chip to overclock with.

    I5-4670K Batch #: 3339B838 (purchased at Micro Center about 2-3weeks ago)
    Mobo: Asus Z87-A
    PSU: Corsair CX600M
    Ram: 2x4Gb Corsair Vengeance 1600mhz (9-9-9-24)
    Stock Idle Temp via Hyper 212 Evo and AS5: 27C-33C
    Ambient Temps: Not sure I live near the coast its about 13-20c outside

    Test 1
    Core Ratio Multiplier: 40
    Cache “Ring” Ratio Multiplier: 38
    Core Voltage: 1.180
    Core Voltage Mode: Manual
    Cache Voltage: Auto (Adaptive)
    Core Voltage Mode: Auto (Adaptive)
    Idle Temp: 36C-42C
    Max Core Temp: 79CMax Temps: 79C, 78C, 78C, 74C
    Stability Test: Prime95 blend test for 10hours 17mins.

    Test 2
    Core Ratio Multiplier: 40
    Cache “Ring” Ratio Multiplier: 38
    Core Voltage: 1.165v
    Core Voltage Mode: Manual
    Cache Voltage: Auto (Adaptive)
    Core Voltage Mode: Auto (Adaptive)
    Idle Temp: 36C-42C
    Max Core Temp: 78C
    Max Temps: 78C, 77C, 76C, 73C
    Stability Test: Prime95 blend test for 1hour 20mins.

    Test 3 (after delid used Test 1 Configuration)
    Core Ratio Multiplier: 40
    Cache “Ring” Ratio Multiplier: 38
    Core Voltage: 1.180
    Core Voltage Mode: Manual
    Cache Voltage: Auto (Adaptive)
    Core Voltage Mode: Auto (Adaptive)
    Idle Temp: 36C-42C
    Max Core Temp: 72C
    Max Temps: 68C, 69C, 72C, 71C
    Stability Test: Prime95 blend test for 1hr.. currently running and going to leave it on overnight.

    I did my best to remove the black glue off the IHS but didn't remove all of it. Not sure if that is the problem. I might use a hairdryer to melt/remove most of it off this upcoming weekend. I carefully used a flat screwdriver to apply the AS5 (did it about 4x) and used it to 'paste' a thin layer. It looks like I'm only going to see about ~5C-7C difference on max core temp. I was hoping for at least double.. My Idle temps before delidding and after delidding seems to remain the same.

    I guess the upside is that if I lower the voltage like I did in Test 2, my max temp will be around 70C or maybe even less. I also like to mention that I have 2noctua push/pull fans (which I regret purchasing) on my Hyper 212 EVO, 1 noctua exhaust fan, and 2 corsair intake fans. Oh well- I guess my goal of a 4.2oc with less than 1.2v/70C seems to be just a dream...

  2. #2
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    Default Re: Delidding/OC Results (Kind of disappointed)

    A couple of thoughts from me:

    first up is your choice of as5. You could do better by using one of the liquid metal type tim's .... Coollaboratory Liquid Pro for example.

    second, I have heard of people having no clearance between the pcb and the ihs when trying to"lid". If you were to remove some of the material that is the very edges of the ihs you may find that the cpu to ihs interface is a tighter fit and therefore runs cooler.



    The above image (courtesy of idontcare at anandtech) may make things clearer. you need to ensure that there is a gap shown in red as .14mm in the pic
    Rig2: 2*e5-26xx (16c/32t @2.4), Asus z9 pe-d8 ws, 32gb ripjawsz under water, rig3 2*e5-26xx (16c/32t @2.4), Supermicro 7047A-T 16GB 1600 ecc reg, on air

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    Default Re: Delidding/OC Results (Kind of disappointed)

    Quote Originally Posted by grumpydaddy View Post
    A couple of thoughts from me:

    first up is your choice of as5. You could do better by using one of the liquid metal type tim's .... Coollaboratory Liquid Pro for example.

    second, I have heard of people having no clearance between the pcb and the ihs when trying to"lid". If you were to remove some of the material that is the very edges of the ihs you may find that the cpu to ihs interface is a tighter fit and therefore runs cooler.



    The above image (courtesy of idontcare at anandtech) may make things clearer. you need to ensure that there is a gap shown in red as .14mm in the pic
    So how do you take off the material?

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    Default Re: Delidding/OC Results (Kind of disappointed)

    Get rid of the black goo with small buffing wheel dipped in isopropyl alcohol and careful use of the dremel. Then lap the edges in the same way you would lap the ihs but there is no need to go to a fine paper just use coarse until you can see daylight between the ihs an the pcb. you might also consider using a gauge even if it is only a cigarette paper. Lapping the ihs too would be good but difficult now
    Rig2: 2*e5-26xx (16c/32t @2.4), Asus z9 pe-d8 ws, 32gb ripjawsz under water, rig3 2*e5-26xx (16c/32t @2.4), Supermicro 7047A-T 16GB 1600 ecc reg, on air

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    Default Re: Delidding/OC Results (Kind of disappointed)

    Quote Originally Posted by grumpydaddy View Post
    Get rid of the black goo with small buffing wheel dipped in isopropyl alcohol and careful use of the dremel. Then lap the edges in the same way you would lap the ihs but there is no need to go to a fine paper just use coarse until you can see daylight between the ihs an the pcb. you might also consider using a gauge even if it is only a cigarette paper. Lapping the ihs too would be good but difficult now
    I see. Thank's for the info.

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    Default Re: Delidding/OC Results (Kind of disappointed)

    Quote Originally Posted by grumpydaddy View Post
    A couple of thoughts from me:

    first up is your choice of as5. You could do better by using one of the liquid metal type tim's .... Coollaboratory Liquid Pro for example.

    second, I have heard of people having no clearance between the pcb and the ihs when trying to"lid". If you were to remove some of the material that is the very edges of the ihs you may find that the cpu to ihs interface is a tighter fit and therefore runs cooler.



    The above image (courtesy of idontcare at anandtech) may make things clearer. you need to ensure that there is a gap shown in red as .14mm in the pic
    Wow I never thought of that idea. I'm going to look into and may try it this weekend. The black glue was definitely a pain.. I tried my credit cards, razor, 'soaked' it with isopropyl alcohol.. It was just impossible. However, I managed to get rid of the black glue off the PCB using some elbow grease. The same can't e said about the IHS. I got the black glue off the edges but not the corners of the recessive area of the IHS. (From what I've seen/read the recessed area with the black glue can be left alone- it's just the edges that matter)

    BTW- I have a question on fan settings during OCing. I have seen a dramatic temp drop when my fans are set to high/max. That leads to my next question.

    Do you keep your cpu fan speed at max speed during stability testing? What about your chassis fans(intake/exhaust) during stability testing? Lastly, what speeds do you keep each fan after stability testing for everyday use @ your particular overclock.

    I ask this because I see several people using this approach which makes obvious sense since it is getting hotter. But then doesn't that defeat the purpose? Because I don't leave all my fans at high/max when I'm just doing everyday tasks. When I run stability tests with my fans on high-- it's a whole different ball game. I just ran 4.0ghz at 1.16v and my core max temp peaked out at 68. Thats about a (~10c-12c drop) So, throughout all the stability testing temp results I have been seeing from forums, I'm assuming they had fan speeds set to max? If that is so.. it all makes sense now. Lol

    I also ordered some cool liquid PRO to put some on my core, and ordered PK3 to put on the IHS.
    Last edited by jsx821; 17-03-2014 at 12:50.

  7. #7
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    Default Re: Delidding/OC Results (Kind of disappointed)

    If you use fan profiles it should ramp up under load to speed of your choice at any given temp.

    If you overclock using offset mode you could save power/heat when not stressing the cpu

    If you are able to leave Cstates and speedstep enabled that will help too
    Rig2: 2*e5-26xx (16c/32t @2.4), Asus z9 pe-d8 ws, 32gb ripjawsz under water, rig3 2*e5-26xx (16c/32t @2.4), Supermicro 7047A-T 16GB 1600 ecc reg, on air

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